New ultraminiature capacitor
The new capacitors have a novel metal-insulator-metal (MIM) structure & a wide range of...
QUEC OPEN
QuecOpenTM is a method that the module is acting as the main processor. With the developing communication technology and changing market, more and more customers have realized the advantages of QuecOpenTM solution. Especially, the advantage that it can reduce the product cost effectively is greatly valued by customers. With the assistance of QuecOpenTM solution, hardware design and software design flow for wireless application will be simplified.
The Main Features for QuecOpenTM Solution are as below:
● Shorten the product development period.
● Simplify the circuit design and reduce the cost.
● Decrease the product’s size.
● Decrease the power consumption.
● Upgraded via QuecOpenTM FOTA.
● Enhance the intellectual property protection with the anti-copy technology.
● Improve the performance-to-price ratio and enhance the competitiveness.
Source: http://www.quectel.com/technology/quecopen.htm
The new capacitors have a novel metal-insulator-metal (MIM) structure & a wide range of...
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